TGF1350 mesfet equivalent, discrete mesfet.
and Performance
*
*
*
*
* 0.5 um x 300 um FET 1.5 dB Noise Figure with 11dB Associated Gain at 10 GHz 2.5 dB Noise Figure with 7 dB Associated Gain at.
DC to 18 GHz. Bond pad is gold plated for compatibility with thermocompression and thermosonic compatibility wire-bondin.
Image gallery
Download